glass to metal seal, multi-piece structured butterfly package, 20 bent copper cored Alloy 50 leads with flattened wire bonding tips, Copper-tungsten base soldered to #10 CRS frame, Au finishing on the leads.
MDFM4333-w20 | |||||
Frame | Base | Leads | Insulators | Solder ring | |
Materials | #10 CRS | W50Cu50 | Copper cored 4J50 | Elan #13 | HLAgCu28 |
Plating | Ni: 1.3~11.4μm | Ni: 1.3~11.4μm; Au≥1.3μm | |||
Dimensions | L:43.18mm W:33.02mm H:7.5mm | ||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.