MDFM4333-w20

MDFM4333-w20

 

 

Description

glass to metal seal, multi-piece structured butterfly package, 20 bent copper cored Alloy 50 leads with flattened wire bonding tips, Copper-tungsten base soldered to #10 CRS frame, Au finishing on the leads.

MDFM4333-w20
  Frame  Base Leads  Insulators  Solder ring
Materials   #10 CRS W50Cu50 Copper cored 4J50 Elan #13  HLAgCu28
Plating  Ni: 1.3~11.4μm  Ni: 1.3~11.4μm; Au≥1.3μm
Dimensions   L:43.18mm W:33.02mm  H:7.5mm
Insulation resistance   ≥1× 1010 Ω (500V DC)
Hermeticity   ≤  1 x 10-3  Pa * cm/s
Note Unspecified tolerances are ±0.2mm

With over two decades of experience helping clients move from prototype to commercialization, Hermetica’s customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our team of engineers can provide a variety of solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.

Get A Quote