Main Features
Optoelectronic Packaging Information
Hermetix Optoelectronic packaging comes in various structural forms, most designed around an optical channel. Users can choose from different molding and manufacturing processes that suit the characteristics of the housing.
This Optoelectronic packaging also called the laser butterfly package, has 8 leads with flattened wire bonding tips copper-tungsten base soldered to the frame of Kovar packages with flange and fiber optic channel.
The Benefits of This Optoelectronic Packaging
Acclaimed laser butterfly package from Hermetix
Major Materials
Being one of the leading glass-to-metal seal manufacturers in the laser butterfly package industry, Hermetix provides you with the types of materials you like according to the features of housing structures, including Kovar, high-quality low-carbon steel, tungsten copper, etc.
Main Applications
This excellent laser butterfly package can be divided into three categories: TO, butterfly packages with optical conduit, and plug-in packages; these products are characterized by their good sealing qualities and excellent heat dissipation.
The following are some main applications of this excellent laser butterfly package:
Optical transmitters, optical detectors, optical modulators, amplifiers, and high-power lasers are widely used in automotive electronics, optical communications, medical equipment, and public safety.
laser butterfly package application
Why Choose Hermetix?
Hermetix, one of the most trustworthy glass-to-metal seal manufacturers, is always dedicated to providing customers with the best quality hermetic packages worldwide. Being a metal packaging manufacturer in this field for decades, we know exactly what you want and will endeavor to satisfy your specific needs. Get to learn more about us:
| MDFO1413-w8 | ||||
| Base | Frame | Leads | Tube | |
| Materials | W85Cu15 | 4J29 | 4J29 | 4J29 |
| Plating | Ni:1.3～11.43μm, Au:≥0.7μm | |||
| Dimensions | L:13.5mm W:13.1mm H:7.1mm±0.15 | |||
| Lead current carrying capacity | ≥1× 1010 Ω (500V DC) | |||
| Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
| Note | Unspecifiedtolerances are ±0.2mm | |||
With over two decades of experience helping clients move from prototype to commercialization, Hermetix customized engineering service offers immense value at the R&D stage. From material selection to pin configuration to sealing techniques, our engineers can provide various solutions to help you overcome the technical obstacles our clients face in the early phases of designing a new product. We can work from your drawings or ours while pinpointing ways to lower costs and improve functionality.
Customization Process
Hermetix Hermetic Optoelectronic Packaging process includes the following steps:
Step 1: Understanding Client Needs
Hermetix engineers collaborate with clients to identify the project’s technical requirements and end-use.
Step 2: Design the Optoelectronic Packaging
Hermetix engineers draft technical drawings focusing on workability from the productions’ point of view and end-user, e.g., bonding and sealing requirements.
Step 3: Monitoring Production Progress
Hermetix keeps track of suppliers’ manufacturing processes, including updating clients on progress and ensuring lead times.
Step 4: Inspection + Shipping
Once products are finished, Hermetix will verify product compliance and ship.
Step 5: After-Sales Services
Hermetix ISO 9001 – Certified Quality Assurance team follows standardized procedures to address and remedy any quality issues immediately.
